SPI 3D Solder paste thickness tester

SPI JET-6000

Performance characteristics:

In response to the trend of miniaturization of circuit board parts and complexity of the board surface, Jiezhi Technology has developed an ultra-efficient JET-6000 circuit board solder paste printing inspection machine. The SPC report uses data and charts to analyze the test results, so that the solder paste test information in the printing process can be fully grasped. In particular, it adopts high-performance RGB linear (Tri-linear) CCD, combined with three-phase displacement imaging technology, with a line scan speed of 152mm/sec and an effective scan width of 42mm, to quickly and accurately detect the printing of solder paste on the circuit board. The advanced three-dimensional calculation mode is highly reliable for high-density solder paste printing inspection.

Product details

In response to the trend of miniaturization of circuit board parts and complexity of the board surface, Jiezhi Technology has developed an ultra-efficient JET-6000 circuit board solder paste printing inspection machine. The SPC report uses data and charts to analyze the test results, so that the solder paste test information in the printing process can be fully grasped. In particular, it adopts high-performance RGB linear (Tri-linear) CCD, combined with three-phase displacement imaging technology, with a line scan speed of 152mm/sec and an effective scan width of 42mm, to quickly and accurately detect the printing of solder paste on the circuit board. The advanced three-dimensional calculation mode is highly reliable for high-density solder paste printing inspection.